SEMI OpenIR  > 半导体集成技术工程研究中心
材料扩散互溶实现碳化硅键合的方法
赵永梅; 何志; 季安; 刘胜北; 黄亚军; 杨香; 段瑞飞; 张明亮; 王晓东; 杨富华
Rights Holder中国科学院半导体所
Date Available2016-09-28
Country中国
Subtype发明
Subject Area微电子学
Application Date2015-04-29
Application NumberCN201510213917.4
Document Type专利
Identifierhttp://ir.semi.ac.cn/handle/172111/27552
Collection半导体集成技术工程研究中心
Recommended Citation
GB/T 7714
赵永梅,何志,季安,等. 材料扩散互溶实现碳化硅键合的方法.
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材料扩散互溶实现碳化硅键合的方法.pdf(323KB) 限制开放LicenseApplication Full Text
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