SEMI OpenIR  > 中科院半导体照明研发中心
低热阻LED封装结构及封装方法
卢鹏志; 杨华; 郑怀文; 于飞; 薛斌; 伊晓燕; 王国宏; 王军喜; 李晋闽
Rights Holder中国科学院半导体研究所
Date Available2013-06-12
Country中国
Subtype发明
Subject Area半导体器件
Application Date2013-03-04
Application NumberCN201310067793.4
Document Type专利
Identifierhttp://ir.semi.ac.cn/handle/172111/25866
Collection中科院半导体照明研发中心
Recommended Citation
GB/T 7714
卢鹏志,杨华,郑怀文,等. 低热阻LED封装结构及封装方法.
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低热阻LED封装结构及封装方法.pdf(622KB) 限制开放LicenseApplication Full Text
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