SEMI OpenIR  > 中科院半导体照明研发中心
晶圆级LED管芯整体集成封装装置
谢海忠; 汪炼成; 张逸韵; 杨华; 李璟; 伊晓燕; 王国宏; 李晋闽
Rights Holder中国科学院半导体研究所
Date Available2012-08-15
Country中国
Subtype发明
Subject Area半导体器件
Application Date2012-04-26
Application NumberCN201210126306.2
Document Type专利
Identifierhttp://ir.semi.ac.cn/handle/172111/25272
Collection中科院半导体照明研发中心
Recommended Citation
GB/T 7714
谢海忠,汪炼成,张逸韵,等. 晶圆级LED管芯整体集成封装装置.
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晶圆级LED管芯整体集成封装装置.pdf(167KB) 限制开放LicenseApplication Full Text
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