SEMI OpenIR  > 中科院半导体照明研发中心
截面为多边形的晶棒及衬底片表面取向的标识方法
王文军; 李晋闽; 王军喜; 马平; 纪攀峰; 郭金霞; 孔庆峰; 胡强
Rights Holder中国科学院半导体研究所
Date Available2014
Country中国
Subtype发明
Subject Area半导体器件
Application Date2013-09-26
Application NumberCN201310444715.1
Document Type专利
Identifierhttp://ir.semi.ac.cn/handle/172111/25519
Collection中科院半导体照明研发中心
Recommended Citation
GB/T 7714
王文军,李晋闽,王军喜,等. 截面为多边形的晶棒及衬底片表面取向的标识方法.
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