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Design of vertical fin arrays with heat pipes used for high-power light-emitting diodes 期刊论文
MICROELECTRONICS RELIABILITY, 2014, 卷号: 54, 期号: 11, 页码: 2448-2455
Authors:  Ye, Huaiyu;  Li, Bo;  Tang, Hongyu;  Zhao, Jia;  Yuan, Cadmus;  Zhang, Guoqi
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Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2014, 卷号: 25, 期号: 11, 页码: 4954-4959
Authors:  Liu, Yang;  Meerwijk, Joost;  Luo, Liangliang;  Zhang, Honglin;  Sun, Fenglian;  Yuan, Cadmus A.;  Zhang, Guoqi
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Chip-on-Flexible Packaging for High-Power Flip-Chip Light-Emitting Diode by AuSn and SAC Soldering 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2014, 卷号: 4, 期号: 11, 页码: 1754-1759
Authors:  Liu, Yang;  Zhao, Jia;  Yuan, Cadmus Chang-Ann;  Zhang, Guoqi Q;  Sun, Fenglian
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Thermal analysis of remote phosphor in LED modules 期刊论文
Journal of Semiconductors, 2013, 卷号: 34, 期号: 5, 页码: 053007
Authors:  Dong, Mingzhi;  Wei, Jia;  Ye, Huaiyu;  Yuan, Cadmus;  Zhang, Kouchi
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Product level accelerated lifetime test for indoor LED luminaires 期刊论文
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013, 2013, 页码: 6529995
Authors:  Koh, Sau;  Yuan, Cadmus;  Sun, Bo;  Li, Bob;  Fan, Xuejun;  Zhang, G.Q.
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