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Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2014, 卷号: 25, 期号: 11, 页码: 4954-4959
Authors:  Liu, Yang;  Meerwijk, Joost;  Luo, Liangliang;  Zhang, Honglin;  Sun, Fenglian;  Yuan, Cadmus A.;  Zhang, Guoqi
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