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Direct Wafer Bonding Technology employing vacuum-cavity pre-bonding 会议论文
Optoeletronic Materials and Devices丛书标题: PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE), Gwangju, SOUTH KOREA, SEP 05-07, 2006
作者:  Yang GH (Yang Guohua);  He GR (He Guorong);  Zheng WH (Zheng Wanhua);  Chen LH (Chen Lianghui);  Yang, GH, Chinese Acad Sci, Inst Semicond, POB 912, Beijing 100083, Peoples R China.
Adobe PDF(1303Kb)  |  收藏  |  浏览/下载:2664/453  |  提交时间:2010/03/29
Desorption and Ripening of Low Density InAs Quantum Dots 会议论文
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, Beijing, PEOPLES R CHINA, JUN 04-06, 2007
作者:  Zhan, F;  Huang, SS;  Niu, ZC;  Ni, HQ;  Xiong, YH;  Fang, ZD;  Zhou, HY;  Luo, Y;  Huang, SS, Tsinghua Univ, Dept Elect Engn, State Key Lab Integrated Optoelect, Beijing 100084, Peoples R China.
Adobe PDF(307Kb)  |  收藏  |  浏览/下载:1624/313  |  提交时间:2010/03/09
Quantum Dots