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一种利用金属材料扩散互溶实现硅-硅键合的方法
赵永梅; 何志; 季安; 王晓峰; 黄亚军; 潘岭峰; 樊中朝; 王晓东; 杨富华
Rights Holder中国科学院半导体所
Date Available2016-09-12
Country中国
Subtype发明
Subject Area微电子学
Application Date2015-08-28
Application NumberCN201510541609.4
Document Type专利
Identifierhttp://ir.semi.ac.cn/handle/172111/27384
Collection半导体集成技术工程研究中心
Recommended Citation
GB/T 7714
赵永梅,何志,季安,等. 一种利用金属材料扩散互溶实现硅-硅键合的方法.
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