SEMI OpenIR  > 中科院半导体照明研发中心
一种LED外延片的切裂方法
孔庆峰; 郭金霞; 纪攀峰; 马平; 王文军; 刘志强; 伊晓燕; 王军喜; 王国宏; 李晋闽
Rights Holder中国科学院半导体所
Date Available2016-08-30
Country中国
Subtype发明
Subject Area半导体器件
Application Date2014-12-24
Application NumberCN201410822161.9
Document Type专利
Identifierhttp://ir.semi.ac.cn/handle/172111/27266
Collection中科院半导体照明研发中心
Recommended Citation
GB/T 7714
孔庆峰,郭金霞,纪攀峰,等. 一种LED外延片的切裂方法.
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