SEMI OpenIR  > 中科院半导体照明研发中心
一种晶圆级基板微通孔电镀方法
王莉; 谢海忠; 刘志强; 伊晓燕; 郭恩卿; 王军喜; 李晋闽
Rights Holder中国科学院半导体研究所
Date Available2014-03-19
Country中国
Subtype发明
Subject Area半导体器件
Application Date2013-12-19
Application NumberCN201310706420.7
Document Type专利
Identifierhttp://ir.semi.ac.cn/handle/172111/25459
Collection中科院半导体照明研发中心
Recommended Citation
GB/T 7714
王莉,谢海忠,刘志强,等. 一种晶圆级基板微通孔电镀方法.
Files in This Item:
File Name/Size DocType Version Access License
一种晶圆级基板微通孔电镀方法.pdf(261KB) 限制开放LicenseApplication Full Text
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[王莉]'s Articles
[谢海忠]'s Articles
[刘志强]'s Articles
Baidu academic
Similar articles in Baidu academic
[王莉]'s Articles
[谢海忠]'s Articles
[刘志强]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[王莉]'s Articles
[谢海忠]'s Articles
[刘志强]'s Articles
Terms of Use
No data!
Social Bookmark/Share
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.