| 光开关阵列模块倒装焊的封装方法 | |
| 张博; 邢界江; 余金中; 俞育德 | |
| Rights Holder | 中国科学院半导体所 |
| Date Available | 2016-09-28 |
| Country | 中国 |
| Subtype | 发明 |
| Subject Area | 光电子学 |
| Application Date | 2015-01-22 |
| Application Number | CN201510032604.9 |
| Document Type | 专利 |
| Identifier | http://ir.semi.ac.cn/handle/172111/27600 |
| Collection | 光电子研究发展中心 |
| Recommended Citation GB/T 7714 | 张博,邢界江,余金中,等. 光开关阵列模块倒装焊的封装方法. |
| Files in This Item: | ||||||
| File Name/Size | DocType | Version | Access | License | ||
| 光开关阵列模块倒装焊的封装方法.pdf（370KB） | 限制开放 | License | Application Full Text | |||
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