| 晶圆级光刻机键合方法 | |
| 毛旭; 赵永梅; 杨香; 黄亚军; 季安; 白云霞; 王晓东; 杨富华 | |
| Rights Holder | 中国科学院半导体所 |
| Date Available | 2016-09-22 |
| Country | 中国 |
| Subtype | 发明 |
| Subject Area | 半导体器件 |
| Application Date | 2015-06-15 |
| Application Number | CN201510326079.1 |
| Document Type | 专利 |
| Identifier | http://ir.semi.ac.cn/handle/172111/27544 |
| Collection | 半导体集成技术工程研究中心 |
| Recommended Citation GB/T 7714 | 毛旭,赵永梅,杨香,等. 晶圆级光刻机键合方法. |
| Files in This Item: | ||||||
| File Name/Size | DocType | Version | Access | License | ||
| 晶圆级光刻机键合方法.pdf（359KB） | 限制开放 | License | Application Full Text | |||
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