一种半导体激光器列阵烧结装置和烧结方法 | |
祁琼; 孔金霞; 熊聪; 仲莉; 刘素平; 马骁宇 | |
Rights Holder | 中国科学院半导体所 |
Date Available | 2016-09-12 |
Country | 中国 |
Subtype | 发明 |
Subject Area | 半导体器件 |
Application Date | 2015-12-29 |
Application Number | CN201511006109.7 |
Document Type | 专利 |
Identifier | http://ir.semi.ac.cn/handle/172111/27381 |
Collection | 光电子器件国家工程中心 |
Recommended Citation GB/T 7714 | 祁琼,孔金霞,熊聪,等. 一种半导体激光器列阵烧结装置和烧结方法. |
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一种半导体激光器列阵烧结装置和烧结方法.(470KB) | 限制开放 | License | Application Full Text |
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