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一种半导体激光器列阵烧结装置和烧结方法
祁琼; 孔金霞; 熊聪; 仲莉; 刘素平; 马骁宇
Rights Holder中国科学院半导体所
Date Available2016-09-12
Country中国
Subtype发明
Subject Area半导体器件
Application Date2015-12-29
Application NumberCN201511006109.7
Document Type专利
Identifierhttp://ir.semi.ac.cn/handle/172111/27381
Collection光电子器件国家工程中心
Recommended Citation
GB/T 7714
祁琼,孔金霞,熊聪,等. 一种半导体激光器列阵烧结装置和烧结方法.
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