SEMI OpenIR  > 光电子研究发展中心
在柔性衬底表面制作硬质微针阵列的方法
裴为华; 张贺; 王宇; 陈远方; 陈弘达
Rights Holder中国科学院半导体所
Date Available2016-09-02
Country中国
Subtype发明
Subject Area光电子学
Application Date2014-07-15
Application NumberCN201410335136.8
Document Type专利
Identifierhttp://ir.semi.ac.cn/handle/172111/27352
Collection光电子研究发展中心
Recommended Citation
GB/T 7714
裴为华,张贺,王宇,等. 在柔性衬底表面制作硬质微针阵列的方法.
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