| 采用晶圆级封装的MEMS器件 | |
| 司朝伟; 韩国威; 宁瑾; 赵永梅; 杨富华 | |
| Rights Holder | 中国科学院半导体所 |
| Date Available | 2016-08-30 |
| Country | 中国 |
| Subtype | 发明 |
| Subject Area | 微电子学 |
| Application Date | 2014-12-04 |
| Application Number | CN201410730304.3 |
| Document Type | 专利 |
| Identifier | http://ir.semi.ac.cn/handle/172111/27260 |
| Collection | 半导体集成技术工程研究中心 |
| Recommended Citation GB/T 7714 | 司朝伟,韩国威,宁瑾,等. 采用晶圆级封装的MEMS器件. |
| Files in This Item: | ||||||
| File Name/Size | DocType | Version | Access | License | ||
| 采用晶圆级封装的MEMS器件.pdf（365KB） | 限制开放 | License | Application Full Text | |||
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