SEMI OpenIR  > 半导体集成技术工程研究中心
应用在MEMS器件中的弱耦合弹性梁结构
司朝伟; 韩国威; 宁瑾; 赵永梅; 杨富华
Rights Holder中国科学院半导体所
Date Available2016-08-30
Country中国
Subtype发明
Subject Area微电子学
Application Date2014-12-04
Application NumberCN201410734012.7
Document Type专利
Identifierhttp://ir.semi.ac.cn/handle/172111/27215
Collection半导体集成技术工程研究中心
Recommended Citation
GB/T 7714
司朝伟,韩国威,宁瑾,等. 应用在MEMS器件中的弱耦合弹性梁结构.
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