SEMI OpenIR  > 中科院半导体材料科学重点实验室
用于超薄半导体芯片接触式曝光的方法
梁平; 胡颖; 刘俊岐; 刘峰奇; 王利军; 张锦川; 王涛; 姚丹阳; 王占国
Rights Holder中国科学院半导体研究所
Date Available2013-07-10
Country中国
Subtype发明
Subject Area半导体材料
Application Date2013-02-22
Application NumberCN201310057280.5
Document Type专利
Identifierhttp://ir.semi.ac.cn/handle/172111/25585
Collection中科院半导体材料科学重点实验室
Recommended Citation
GB/T 7714
梁平,胡颖,刘俊岐,等. 用于超薄半导体芯片接触式曝光的方法.
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用于超薄半导体芯片接触式曝光的方法.pd(276KB) 限制开放LicenseApplication Full Text
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