SEMI OpenIR  > 半导体集成技术工程研究中心
面向片上集成的热电器件制备方法
王珍; 祁洋洋; 张明亮; 杨富华; 王晓东
Rights Holder中国科学院半导体研究所
Date Available2014-01-15
Country中国
Subtype发明
Subject Area微电子学
Application Date2013-10-23
Application NumberCN201310503144.4
Document Type专利
Identifierhttp://ir.semi.ac.cn/handle/172111/25499
Collection半导体集成技术工程研究中心
Recommended Citation
GB/T 7714
王珍,祁洋洋,张明亮,等. 面向片上集成的热电器件制备方法.
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面向片上集成的热电器件制备方法.pdf(1189KB) 限制开放LicenseApplication Full Text
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