| 晶圆级微透镜压印成型方法 | |
| 谢海忠; 王莉; 杨华; 李璟; 刘志强; 伊晓燕; 王军喜; 王国宏; 李晋闽 | |
| Rights Holder | 中国科学院半导体研究所 |
| Date Available | 2014-02-12 |
| Country | 中国 |
| Subtype | 发明 |
| Subject Area | 半导体器件 |
| Application Date | 2013-11-19 |
| Application Number | CN201310585537.4 |
| Document Type | 专利 |
| Identifier | http://ir.semi.ac.cn/handle/172111/25475 |
| Collection | 中科院半导体照明研发中心 |
| Recommended Citation GB/T 7714 | 谢海忠,王莉,杨华,等. 晶圆级微透镜压印成型方法. |
| Files in This Item: | ||||||
| File Name/Size | DocType | Version | Access | License | ||
| 晶圆级微透镜压印成型方法.pdf（227KB） | 限制开放 | License | Application Full Text | |||
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