Direct Wafer Bonding Technology employing vacuum-cavity pre-bonding

SEMI OpenIR > 中国科学院半导体研究所（2009年前）

	Direct Wafer Bonding Technology employing vacuum-cavity pre-bonding
	Yang GH (Yang Guohua); He GR (He Guorong); Zheng WH (Zheng Wanhua); Chen LH (Chen Lianghui); Yang, GH, Chinese Acad Sci, Inst Semicond, POB 912, Beijing 100083, Peoples R China.
	2006
会议名称	Conference on Optoelectronic Materials and Devices
会议录名称	Optoeletronic Materials and Devices丛书标题: PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE)
页码	Pts 1 and 2 6352: U1388-U1395 Part 1-2
会议日期	SEP 05-07, 2006
会议地点	Gwangju, SOUTH KOREA
出版地	1000 20TH ST, PO BOX 10, BELLINGHAM, WA 98227-0010 USA
出版者	SPIE-INT SOC OPTICAL ENGINEERING
ISSN	0277-786X
ISBN	0-8194-6447-3
部门归属	chinese acad sci, inst semicond, beijing 100083, peoples r china
摘要	A novel low temperature direct wafer bonding technology employing vacuum-cavity pre-bonding is proposed and applied in bonding of InGaAs/Si couple wafers under 300 degrees C and InP/GaAs couple wafers under 350 degrees C. Aligning accuracy of 0.5 mu m is achieved. During wafer bonding process the pressure on the couple wafers is 10MPa. The interface energy is sufficiently high to allow thinning of the wafers down from 350um to about 100um. And the tensile strength test indicates the bonding energy of bonded samples is about equal to the bonded samples at 550 degrees C.
学科领域	光电子学
主办者	Opt Soc Korea.; SPIE.; Korea Assoc Photon Ind Dev.; Gwangju City.; Chinese Opt Soc.; IEEE Commun Soc.; IEEE Laser & Electro Opt Soc.; Opt Soc Amer.; Opt Soc Japan.; Inst Elect Engineers Korea.; Korean Inst Commun Sci.
收录类别	其他
语种	英语
文献类型	会议论文
条目标识符	http://ir.semi.ac.cn/handle/172111/9770
专题	中国科学院半导体研究所（2009年前）
通讯作者	Yang, GH, Chinese Acad Sci, Inst Semicond, POB 912, Beijing 100083, Peoples R China.
推荐引用方式 GB/T 7714	Yang GH ,He GR ,Zheng WH ,et al. Direct Wafer Bonding Technology employing vacuum-cavity pre-bonding[C]. 1000 20TH ST, PO BOX 10, BELLINGHAM, WA 98227-0010 USA:SPIE-INT SOC OPTICAL ENGINEERING,2006:Pts 1 and 2 6352: U1388-U1395 Part 1-2.

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