SEMI OpenIR  > 中国科学院半导体研究所(2009年前)
微机电系统薄膜材料力学性能与可靠性测试方法和装置
杨晋玲; 周 威; 杨富华 
2009-09-02
Rights Holder中科院半导体研究所
Date Available4005
Country中国
Subtype发明
Application Date2008-02-27
Language中文
Status公开
Application NumberCN200810100953
Patent Agent汤宝平
Document Type专利
Identifierhttp://ir.semi.ac.cn/handle/172111/9078
Collection中国科学院半导体研究所(2009年前)
Recommended Citation
GB/T 7714
杨晋玲,周 威,杨富华 . 微机电系统薄膜材料力学性能与可靠性测试方法和装置[P]. 2009-09-02.
Files in This Item:
File Name/Size DocType Version Access License
3474.pdf(953KB) 限制开放--Application Full Text
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[杨晋玲]'s Articles
[周 威]'s Articles
[杨富华 ]'s Articles
Baidu academic
Similar articles in Baidu academic
[杨晋玲]'s Articles
[周 威]'s Articles
[杨富华 ]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[杨晋玲]'s Articles
[周 威]'s Articles
[杨富华 ]'s Articles
Terms of Use
No data!
Social Bookmark/Share
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.