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一种表面贴装LED用的陶瓷外壳
谭满清; 郭小峰; 刘珩; 曹迎春; 赵亚利
Rights Holder中国科学院半导体研究所
Date Available2013-11-20
Country中国
Subtype发明
Subject Area光电子学
Application Date2013-04-10
Application NumberCN201320176566.0
Document Type专利
Identifierhttp://ir.semi.ac.cn/handle/172111/25813
Collection光电子研究发展中心
Recommended Citation
GB/T 7714
谭满清,郭小峰,刘珩,等. 一种表面贴装LED用的陶瓷外壳.
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