SEMI OpenIR  > 中科院半导体材料科学重点实验室
半导体材料微区应力测试系统
高寒松; 陈涌海; 张宏毅; 刘雨
Rights Holder中国科学院半导体研究所
Date Available2013-09-18
Country中国
Subtype发明
Subject Area半导体材料
Application Date2013-05-23
Application NumberCN201310194074.9
Document Type专利
Identifierhttp://ir.semi.ac.cn/handle/172111/25602
Collection中科院半导体材料科学重点实验室
Recommended Citation
GB/T 7714
高寒松,陈涌海,张宏毅,等. 半导体材料微区应力测试系统.
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半导体材料微区应力测试系统.pdf(527KB) 限制开放LicenseApplication Full Text
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