Knowledge Management System Of Institute of Semiconductors,CAS
A practical package technique for FBG-based temperature independent sensor | |
Tian, K; Liu, YL; Wang, QM; Tian, K, Chinese Acad Sci, Inst Semicond, Res & Dev Ctr Optoelect, Beijing 100083, Peoples R China. | |
2004 | |
会议名称 | 7th International Conference on Solid-State and Integrated Circuits Technology |
会议录名称 | 20047TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUITS TECHNOLOGY |
页码 | VOLS 1- 3 PROCEEDINGS: 1908-1910 |
会议日期 | OCT 18-21, 2004 |
会议地点 | Beijing, PEOPLES R CHINA |
出版地 | 345 E 47TH ST, NEW YORK, NY 10017 USA |
出版者 | IEEE |
ISBN | 0-7803-8511-X |
部门归属 | chinese acad sci, inst semicond, res & dev ctr optoelect, beijing 100083, peoples r china |
摘要 | A practical package technique for temperature independent Fiber Bragg grating sensor is proposed. A uniform strength cantilever with two FBG attached on the upper and lower surfaces was utilized as the key element. By detecting two wavelengths differential output, the applied force can be obtained and temperature effects can be eliminated. Experiment results show the sensor has linear response and output signal uctuates less than 12pm as temperature changes from -10 degrees C to 50 degrees C. The maximum thermal error is less than 0.3% of the full measurement range. |
关键词 | Gratings |
学科领域 | 光电子学 |
主办者 | Chinese Inst Elect.; IEEE Beijing Sect.; IEEE Elect Devices Soc.; IEEE EDS Beijing Chapter.; IEEE Solid-State Circuits Soc.; IEEE SSCS Beijing Chapter.; Japan Soc Appl Phys.; IEE Elect Div.; URSI Commiss D.; Inst Elect Engineers Korea.; Natl Nat Sci Fdn China.; Beijing Municipal Bureau Ind Dev.; Peking Univ. |
收录类别 | CPCI-S |
语种 | 英语 |
文献类型 | 会议论文 |
条目标识符 | http://ir.semi.ac.cn/handle/172111/10098 |
专题 | 中国科学院半导体研究所(2009年前) |
通讯作者 | Tian, K, Chinese Acad Sci, Inst Semicond, Res & Dev Ctr Optoelect, Beijing 100083, Peoples R China. |
推荐引用方式 GB/T 7714 | Tian, K,Liu, YL,Wang, QM,et al. A practical package technique for FBG-based temperature independent sensor[C]. 345 E 47TH ST, NEW YORK, NY 10017 USA:IEEE,2004:VOLS 1- 3 PROCEEDINGS: 1908-1910. |
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