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一种光纤端头封装机构
张志研; 林学春; 牛奔; 南景洋; 侯玮
Rights Holder中国科学院半导体研究所
Date Available2014-05-07
Country中国
Subtype发明
Subject Area半导体器件
Application Date2014-01-24
Application NumberCN201410035610.5
Document Type专利
Identifierhttp://ir.semi.ac.cn/handle/172111/25845
Collection全固态光源实验室
Recommended Citation
GB/T 7714
张志研,林学春,牛奔,等. 一种光纤端头封装机构.
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