SEMI OpenIR  > 中科院半导体材料科学重点实验室
在硅片上制作八边形微孔的方法
黄永光; 王熙元; 刘德伟; 朱小宁; 王宝军; 朱洪亮
Rights Holder中国科学院半导体研究所
Date Available2012-10-24
Country中国
Subtype发明
Subject Area半导体材料
Application Date2012-07-09
Application NumberCN201210236356.6
Document Type专利
Identifierhttp://ir.semi.ac.cn/handle/172111/25286
Collection中科院半导体材料科学重点实验室
Recommended Citation
GB/T 7714
黄永光,王熙元,刘德伟,等. 在硅片上制作八边形微孔的方法.
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在硅片上制作八边形微孔的方法.pdf(1592KB) 限制开放LicenseApplication Full Text
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