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Upconversion emission of a Er3+-doped glass microsphere under 633 nm excitation | |
Wang JY; Ji GR; Jin P; Zhao LJ; Zhang CZ; Wang JY Bewing Univ Technol Coll Appl Sci Beijing 100022 Peoples R China. 电子邮箱地址: wangjiyou@bjut.edu.cn | |
2004 | |
会议名称 | 8th IUMRS International Conference on Electronic Materials (IUMRS/ICEM) |
会议录名称 | MICROELECTRONICS JOURNAL, 35 (4) |
页码 | 353-355 |
会议日期 | JUN 10-14, 2002 |
会议地点 | XIAN, PEOPLES R CHINA |
出版地 | THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD OX5 1GB, OXON, ENGLAND |
出版者 | ELSEVIER SCI LTD |
ISSN | 0026-2692 |
部门归属 | bewing univ technol, coll appl sci, beijing 100022, peoples r china; chinese acad sci, inst semicond, key lab semicond mat sci, beijing, peoples r china; nankai univ, coll phys sci, phtoton ctr, tianjin, peoples r china |
摘要 | In this work, The TBS glass microspheres doped with Er3+ for morphology-dependent resonances of upconversion emission were designed. The glass sample components are 25TiO(2)-27BaCO(3)-8Ba(NO3)(2)-6ZnO(2)-9CaCO(3)-5H(3)BO(3)-10SiO(2)-7water glass-3Er(2)O(3) (wt%), and the emission spectra of TBS glass and a TBS glass microsphere (about 48 mum in diameter) were measured under 633 nm excitation and discussed. The strong morphology-dependent resonances of upconversion luminescences in the microsphere were observed. The observed resonances could be assigned by using the well-known Lorenz-Mie Formalism. (C) 2003 Elsevier Ltd. All rights reserved. |
关键词 | Upconversion Doped-er3++ Glass Microsphere Morphology-dependent Resonances |
学科领域 | 半导体器件 |
主办者 | Chinese Mat Res Soc.; Int Union Mat Res Soc. |
收录类别 | CPCI-S |
语种 | 英语 |
文献类型 | 会议论文 |
条目标识符 | http://ir.semi.ac.cn/handle/172111/13603 |
专题 | 中国科学院半导体研究所(2009年前) |
通讯作者 | Wang JY Bewing Univ Technol Coll Appl Sci Beijing 100022 Peoples R China. 电子邮箱地址: wangjiyou@bjut.edu.cn |
推荐引用方式 GB/T 7714 | Wang JY,Ji GR,Jin P,et al. Upconversion emission of a Er3+-doped glass microsphere under 633 nm excitation[C]. THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD OX5 1GB, OXON, ENGLAND:ELSEVIER SCI LTD,2004:353-355. |
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