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题名作者发表日期▼ 全文
Finite element analysis of expansion-matched submounts for high-power laser diodes packaging [期刊论文]Ni Yuxi; Ma Xiaoyu; Jing Hongqi; Liu Suping2016
Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics [期刊论文]Jing Hongqi; Zhong Li; Ni Yuxi; Zhang Junjie; Liu Suping; Ma Xiaoyu2016
Finite element analysis of expansion-matched submounts for high-power laser diodes packaging [期刊论文]Ni Yuxi; Ma Xiaoyu; Jing Hongqi; Liu Suping2016
Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics [期刊论文]Jing Hongqi; Zhong Li; Ni Yuxi; Zhang Junjie; Liu Suping; Ma Xiaoyu2016

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