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Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics 期刊论文
Journal of Semiconductors, 2016, 卷号: 36, 期号: 10, 页码: 102006
Authors:  Jing Hongqi;  Zhong Li;  Ni Yuxi;  Zhang Junjie;  Liu Suping;  Ma Xiaoyu
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Finite element analysis of expansion-matched submounts for high-power laser diodes packaging 期刊论文
Journal of Semiconductors, 2016, 卷号: 37, 期号: 6, 页码: 064005
Authors:  Ni Yuxi;  Ma Xiaoyu;  Jing Hongqi;  Liu Suping
Adobe PDF(795Kb)  |  Favorite  |  View/Download:341/3  |  Submit date:2017/03/16