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Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics 期刊论文
Journal of Semiconductors, 2016, 卷号: 36, 期号: 10, 页码: 102006
Authors:  Jing Hongqi;  Zhong Li;  Ni Yuxi;  Zhang Junjie;  Liu Suping;  Ma Xiaoyu
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Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics 期刊论文
Journal of Semiconductors, 2016, 卷号: 36, 期号: 10, 页码: 102006
Authors:  Jing Hongqi;  Zhong Li;  Ni Yuxi;  Zhang Junjie;  Liu Suping;  Ma Xiaoyu
Adobe PDF(1683Kb)  |  Favorite  |  View/Download:264/3  |  Submit date:2017/03/16