SEMI OpenIR

Browse/Search Results:  1-4 of 4 Help

Filters    
Selected(0)Clear Items/Page:    Sort:
Finite element analysis of expansion-matched submounts for high-power laser diodes packaging 期刊论文
Journal of Semiconductors, 2016, 卷号: 37, 期号: 6, 页码: 064005
Authors:  Ni Yuxi;  Ma Xiaoyu;  Jing Hongqi;  Liu Suping
Adobe PDF(795Kb)  |  Favorite  |  View/Download:629/6  |  Submit date:2017/03/02
Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics 期刊论文
Journal of Semiconductors, 2016, 卷号: 36, 期号: 10, 页码: 102006
Authors:  Jing Hongqi;  Zhong Li;  Ni Yuxi;  Zhang Junjie;  Liu Suping;  Ma Xiaoyu
Adobe PDF(1683Kb)  |  Favorite  |  View/Download:341/3  |  Submit date:2017/03/16
Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics 期刊论文
Journal of Semiconductors, 2016, 卷号: 36, 期号: 10, 页码: 102006
Authors:  Jing Hongqi;  Zhong Li;  Ni Yuxi;  Zhang Junjie;  Liu Suping;  Ma Xiaoyu
Adobe PDF(1683Kb)  |  Favorite  |  View/Download:281/3  |  Submit date:2017/03/16
Finite element analysis of expansion-matched submounts for high-power laser diodes packaging 期刊论文
Journal of Semiconductors, 2016, 卷号: 37, 期号: 6, 页码: 064005
Authors:  Ni Yuxi;  Ma Xiaoyu;  Jing Hongqi;  Liu Suping
Adobe PDF(795Kb)  |  Favorite  |  View/Download:341/3  |  Submit date:2017/03/16