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Flip-chip bonded hybrid CMOS/SEED optoelectronic smart pixels 会议论文
IEE PROCEEDINGS-OPTOELECTRONICS, 147 (1), CARDIFF, WALES, 1999
作者:  Chen HD;  Liang K;  Zeng QM;  Li XJ;  Chen ZB;  Du Y;  Wu RH;  Chen HD Chinese Acad Sci Inst Semicond State Key Lab Integrated Optoelect Beijing 100083 Peoples R China.
Adobe PDF(545Kb)  |  收藏  |  浏览/下载：1345/326  |  提交时间：2010/11/15
Mqw Modulators  Effect Device  Progress  Circuits  Cmos  
A model of dislocations at the interface of the bonded wafers 会议论文
OPTICAL INTERCONNECTS FOR TELECOMMUNICATION AND DATA COMMUNICATIONS, 4225, BEIJING, PEOPLES R CHINA, NOV 08-10, 2000
作者:  Han WH;  Yu JZ;  Wang LC;  Wei HZ;  Zhang XF;  Wang QM;  Han WH Chinese Acad Sci Inst Semicond State Key Lab Integrated Optoelect POB 912 Beijing 100083 Peoples R China.
Adobe PDF(76Kb)  |  收藏  |  浏览/下载：1565/266  |  提交时间：2010/10/29
Wafer Bonding  Heteroepitaxy  Lattice Mismatch  Edge-like Dislocations  Thermal Stress  60 Degrees Dislocation Lines  Gaas