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SEMI OpenIR  > 中国科学院半导体研究所（2009年前）
半导体薄片材料的横向研磨方法
陈弘达; 裴为华
2006-08-09
Date Available2009-06-04 ; 2009-06-11
Subtype发明
Application Date2005-01-31
Language中文
Application Number200510006190
Document Type专利
Identifierhttp://ir.semi.ac.cn/handle/172111/3401
Collection中国科学院半导体研究所（2009年前）
Recommended Citation
GB/T 7714		 陈弘达,裴为华. 半导体薄片材料的横向研磨方法[P]. 2006-08-09.
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200510006190.pdf（425KB） 限制开放--Application Full Text
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