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Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via
Meng Zhang;   Jian Yang ;   Yurong He ;   Fan Yang ;   Fuhua Yang ;   Guowei Han ;   Chaowei Si;   Jin Ning
2019
Source PublicationSensors
Volume19Pages:93
Indexed BySCI
Document Type期刊论文
Identifierhttp://ir.semi.ac.cn/handle/172111/29847
Collection半导体集成技术工程研究中心
Recommended Citation
GB/T 7714
Meng Zhang; Jian Yang ; Yurong He ; Fan Yang ; Fuhua Yang ; Guowei Han ; Chaowei Si; Jin Ning. Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via[J]. Sensors,2019,19:93.
APA Meng Zhang; Jian Yang ; Yurong He ; Fan Yang ; Fuhua Yang ; Guowei Han ; Chaowei Si; Jin Ning.(2019).Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via.Sensors,19,93.
MLA Meng Zhang; Jian Yang ; Yurong He ; Fan Yang ; Fuhua Yang ; Guowei Han ; Chaowei Si; Jin Ning."Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via".Sensors 19(2019):93.
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Research on a 3D Enc(3329KB)期刊论文作者接受稿限制开放CC BY-NC-SAApplication Full Text
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