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A Single Mode Hybrid III–V/Silicon On-Chip Laser Based on Flip-Chip Bonding Technology for Optical Interconnection
Hai-Ling Wang; Wan-Hua Zheng
2016
Source PublicationChinese Physics Letters
Volume33Issue:12Pages:124207
Subject Area光电子学
Indexed BySCI
Date Available2017-03-16
Document Type期刊论文
Identifierhttp://ir.semi.ac.cn/handle/172111/27964
Collection固态光电信息技术实验室
Recommended Citation
GB/T 7714
Hai-Ling Wang,Wan-Hua Zheng. A Single Mode Hybrid III–V/Silicon On-Chip Laser Based on Flip-Chip Bonding Technology for Optical Interconnection[J]. Chinese Physics Letters,2016,33(12):124207.
APA Hai-Ling Wang,&Wan-Hua Zheng.(2016).A Single Mode Hybrid III–V/Silicon On-Chip Laser Based on Flip-Chip Bonding Technology for Optical Interconnection.Chinese Physics Letters,33(12),124207.
MLA Hai-Ling Wang,et al."A Single Mode Hybrid III–V/Silicon On-Chip Laser Based on Flip-Chip Bonding Technology for Optical Interconnection".Chinese Physics Letters 33.12(2016):124207.
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