Knowledge Management System Of Institute of Semiconductors,CAS
A Single Mode Hybrid III–V/Silicon On-Chip Laser Based on Flip-Chip Bonding Technology for Optical Interconnection | |
Hai-Ling Wang; Wan-Hua Zheng | |
2016 | |
Source Publication | Chinese Physics Letters
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Volume | 33Issue:12Pages:124207 |
Subject Area | 光电子学 |
Indexed By | SCI |
Date Available | 2017-03-16 |
Document Type | 期刊论文 |
Identifier | http://ir.semi.ac.cn/handle/172111/27964 |
Collection | 固态光电信息技术实验室 |
Recommended Citation GB/T 7714 | Hai-Ling Wang,Wan-Hua Zheng. A Single Mode Hybrid III–V/Silicon On-Chip Laser Based on Flip-Chip Bonding Technology for Optical Interconnection[J]. Chinese Physics Letters,2016,33(12):124207. |
APA | Hai-Ling Wang,&Wan-Hua Zheng.(2016).A Single Mode Hybrid III–V/Silicon On-Chip Laser Based on Flip-Chip Bonding Technology for Optical Interconnection.Chinese Physics Letters,33(12),124207. |
MLA | Hai-Ling Wang,et al."A Single Mode Hybrid III–V/Silicon On-Chip Laser Based on Flip-Chip Bonding Technology for Optical Interconnection".Chinese Physics Letters 33.12(2016):124207. |
Files in This Item: | ||||||
File Name/Size | DocType | Version | Access | License | ||
A Single Mode Hybrid(807KB) | 限制开放 | License | Application Full Text |
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