A Single Mode Hybrid III–V/Silicon On-Chip Laser Based on Flip-Chip Bonding Technology for Optical Interconnection

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	A Single Mode Hybrid III–V/Silicon On-Chip Laser Based on Flip-Chip Bonding Technology for Optical Interconnection
	Hai-Ling Wang; Wan-Hua Zheng
	2016
Source Publication	Chinese Physics Letters
Volume	33 Issue:12 Pages:124207
Subject Area	光电子学
Indexed By	SCI
Date Available	2017-03-16
Document Type	期刊论文
Identifier	http://ir.semi.ac.cn/handle/172111/27964
Collection	固态光电信息技术实验室
Recommended Citation GB/T 7714	Hai-Ling Wang,Wan-Hua Zheng. A Single Mode Hybrid III–V/Silicon On-Chip Laser Based on Flip-Chip Bonding Technology for Optical Interconnection[J]. Chinese Physics Letters,2016,33(12):124207.
APA	Hai-Ling Wang,&Wan-Hua Zheng.(2016).A Single Mode Hybrid III–V/Silicon On-Chip Laser Based on Flip-Chip Bonding Technology for Optical Interconnection.Chinese Physics Letters,33(12),124207.
MLA	Hai-Ling Wang,et al."A Single Mode Hybrid III–V/Silicon On-Chip Laser Based on Flip-Chip Bonding Technology for Optical Interconnection".Chinese Physics Letters 33.12(2016):124207.

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