| Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics | |
| Jing Hongqi; Zhong Li; Ni Yuxi; Zhang Junjie; Liu Suping; Ma Xiaoyu | |
| 2016 | |
| Source Publication | Journal of Semiconductors
 |
| Volume | 36Issue:10Pages:102006 |
| Subject Area | 半导体器件 |
| Indexed By | SCI |
| Date Available | 2017-03-16 |
| Document Type | 期刊论文 |
| Identifier | http://ir.semi.ac.cn/handle/172111/27948 |
| Collection | 光电子器件国家工程中心 |
| Recommended Citation GB/T 7714 | Jing Hongqi,Zhong Li,Ni Yuxi,et al. Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics[J]. Journal of Semiconductors,2016,36(10):102006. |
| APA | Jing Hongqi,Zhong Li,Ni Yuxi,Zhang Junjie,Liu Suping,&Ma Xiaoyu.(2016).Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics.Journal of Semiconductors,36(10),102006. |
| MLA | Jing Hongqi,et al."Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics".Journal of Semiconductors 36.10(2016):102006. |
| Files in This Item: | ||||||
| File Name/Size | DocType | Version | Access | License | ||
| Design and simulatio（1683KB） | 限制开放 | License | Application Full Text | |||
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