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Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics
Jing Hongqi; Zhong Li; Ni Yuxi; Zhang Junjie; Liu Suping; Ma Xiaoyu
2016
Source PublicationJournal of Semiconductors
Volume36Issue:10Pages:102006
Subject Area半导体器件
Indexed BySCI
Date Available2017-03-16
Document Type期刊论文
Identifierhttp://ir.semi.ac.cn/handle/172111/27944
Collection半导体集成技术工程研究中心
Recommended Citation
GB/T 7714
Jing Hongqi,Zhong Li,Ni Yuxi,et al. Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics[J]. Journal of Semiconductors,2016,36(10):102006.
APA Jing Hongqi,Zhong Li,Ni Yuxi,Zhang Junjie,Liu Suping,&Ma Xiaoyu.(2016).Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics.Journal of Semiconductors,36(10),102006.
MLA Jing Hongqi,et al."Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics".Journal of Semiconductors 36.10(2016):102006.
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