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A low feed-through 3D vacuum packaging technique with silicon vias for RF MEMS resonators
Jicong Zhao; Quan Yuan; Xiao Kan; and Jinling Yang; Fuhua Yang
2016
Source PublicationJournal of Micromechanics and Microengineering
Volume27Issue:1Pages:014003
Subject Area微电子学
Indexed BySCI
Date Available2017-03-16
Document Type期刊论文
Identifierhttp://ir.semi.ac.cn/handle/172111/27904
Collection半导体集成技术工程研究中心
Recommended Citation
GB/T 7714
Jicong Zhao,Quan Yuan,Xiao Kan,et al. A low feed-through 3D vacuum packaging technique with silicon vias for RF MEMS resonators[J]. Journal of Micromechanics and Microengineering,2016,27(1):014003.
APA Jicong Zhao,Quan Yuan,Xiao Kan,and Jinling Yang,&Fuhua Yang.(2016).A low feed-through 3D vacuum packaging technique with silicon vias for RF MEMS resonators.Journal of Micromechanics and Microengineering,27(1),014003.
MLA Jicong Zhao,et al."A low feed-through 3D vacuum packaging technique with silicon vias for RF MEMS resonators".Journal of Micromechanics and Microengineering 27.1(2016):014003.
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