| Finite element analysis of expansion-matched submounts for high-power laser diodes packaging | |
| Ni Yuxi; Ma Xiaoyu; Jing Hongqi; Liu Suping | |
| 2016 | |
| Source Publication | Journal of Semiconductors
 |
| Volume | 37Issue:6Pages:064005 |
| Subject Area | 半导体器件 |
| Indexed By | SCI |
| Date Available | 2017-03-02 |
| Document Type | 期刊论文 |
| Identifier | http://ir.semi.ac.cn/handle/172111/27673 |
| Collection | 光电子器件国家工程中心 |
| Recommended Citation GB/T 7714 | Ni Yuxi,Ma Xiaoyu,Jing Hongqi,et al. Finite element analysis of expansion-matched submounts for high-power laser diodes packaging[J]. Journal of Semiconductors,2016,37(6):064005. |
| APA | Ni Yuxi,Ma Xiaoyu,Jing Hongqi,&Liu Suping.(2016).Finite element analysis of expansion-matched submounts for high-power laser diodes packaging.Journal of Semiconductors,37(6),064005. |
| MLA | Ni Yuxi,et al."Finite element analysis of expansion-matched submounts for high-power laser diodes packaging".Journal of Semiconductors 37.6(2016):064005. |
| Files in This Item: | ||||||
| File Name/Size | DocType | Version | Access | License | ||
| Finite element analy（795KB） | 限制开放 | License | Application Full Text | |||
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