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Finite element analysis of expansion-matched submounts for high-power laser diodes packaging
Ni Yuxi; Ma Xiaoyu; Jing Hongqi; Liu Suping
2016
Source PublicationJournal of Semiconductors
Volume37Issue:6Pages:064005
Subject Area半导体器件
Indexed BySCI
Date Available2017-03-02
Document Type期刊论文
Identifierhttp://ir.semi.ac.cn/handle/172111/27673
Collection光电子器件国家工程中心
Recommended Citation
GB/T 7714
Ni Yuxi,Ma Xiaoyu,Jing Hongqi,et al. Finite element analysis of expansion-matched submounts for high-power laser diodes packaging[J]. Journal of Semiconductors,2016,37(6):064005.
APA Ni Yuxi,Ma Xiaoyu,Jing Hongqi,&Liu Suping.(2016).Finite element analysis of expansion-matched submounts for high-power laser diodes packaging.Journal of Semiconductors,37(6),064005.
MLA Ni Yuxi,et al."Finite element analysis of expansion-matched submounts for high-power laser diodes packaging".Journal of Semiconductors 37.6(2016):064005.
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