Finite element analysis of expansion-matched submounts for high-power laser diodes packaging | |
Ni Yuxi; Ma Xiaoyu; Jing Hongqi; Liu Suping | |
2016 | |
Source Publication | Journal of Semiconductors
![]() |
Volume | 37Issue:6Pages:064005 |
Subject Area | 半导体器件 |
Indexed By | SCI |
Date Available | 2017-03-02 |
Document Type | 期刊论文 |
Identifier | http://ir.semi.ac.cn/handle/172111/27673 |
Collection | 光电子器件国家工程中心 |
Recommended Citation GB/T 7714 | Ni Yuxi,Ma Xiaoyu,Jing Hongqi,et al. Finite element analysis of expansion-matched submounts for high-power laser diodes packaging[J]. Journal of Semiconductors,2016,37(6):064005. |
APA | Ni Yuxi,Ma Xiaoyu,Jing Hongqi,&Liu Suping.(2016).Finite element analysis of expansion-matched submounts for high-power laser diodes packaging.Journal of Semiconductors,37(6),064005. |
MLA | Ni Yuxi,et al."Finite element analysis of expansion-matched submounts for high-power laser diodes packaging".Journal of Semiconductors 37.6(2016):064005. |
Files in This Item: | ||||||
File Name/Size | DocType | Version | Access | License | ||
Finite element analy(795KB) | 限制开放 | License | Application Full Text |
Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.
Edit Comment