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A Wafer-Level Sn-Rich Au-Sn Bonding Technique and Its Application in Surface Plasmon Resonance Sensors
Mao, X; Lv, XD; Wei, WW; Zhang, Z; Yang, JL; Qi, ZM; Yang, FH
2014
Source PublicationCHINESE PHYSICS LETTERS
Volume31Issue:5Pages:056803
Subject Area微电子学
Indexed BySCI
Language英语
Date Available2015-04-02
Document Type期刊论文
Identifierhttp://ir.semi.ac.cn/handle/172111/26315
Collection半导体集成技术工程研究中心
Recommended Citation
GB/T 7714
Mao, X,Lv, XD,Wei, WW,et al. A Wafer-Level Sn-Rich Au-Sn Bonding Technique and Its Application in Surface Plasmon Resonance Sensors[J]. CHINESE PHYSICS LETTERS,2014,31(5):056803.
APA Mao, X.,Lv, XD.,Wei, WW.,Zhang, Z.,Yang, JL.,...&Yang, FH.(2014).A Wafer-Level Sn-Rich Au-Sn Bonding Technique and Its Application in Surface Plasmon Resonance Sensors.CHINESE PHYSICS LETTERS,31(5),056803.
MLA Mao, X,et al."A Wafer-Level Sn-Rich Au-Sn Bonding Technique and Its Application in Surface Plasmon Resonance Sensors".CHINESE PHYSICS LETTERS 31.5(2014):056803.
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