SEMI OpenIR  > 中科院半导体照明研发中心
Thermal and mechanical effects of voids within flip chip soldering in LED packages
Liu, Y; Leung, SYY; Zhao, J; Wong, CKY; Yuan, CA; Zhang, GQ; Sun, FL; Luo, LL
2014
Source PublicationMICROELECTRONICS RELIABILITY
Volume54Issue:9-10Pages:2028-2033
Subject Area半导体器件
Indexed BySCI
Language英语
Date Available2015-03-25
Document Type期刊论文
Identifierhttp://ir.semi.ac.cn/handle/172111/26184
Collection中科院半导体照明研发中心
Recommended Citation
GB/T 7714
Liu, Y,Leung, SYY,Zhao, J,et al. Thermal and mechanical effects of voids within flip chip soldering in LED packages[J]. MICROELECTRONICS RELIABILITY,2014,54(9-10):2028-2033.
APA Liu, Y.,Leung, SYY.,Zhao, J.,Wong, CKY.,Yuan, CA.,...&Luo, LL.(2014).Thermal and mechanical effects of voids within flip chip soldering in LED packages.MICROELECTRONICS RELIABILITY,54(9-10),2028-2033.
MLA Liu, Y,et al."Thermal and mechanical effects of voids within flip chip soldering in LED packages".MICROELECTRONICS RELIABILITY 54.9-10(2014):2028-2033.
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