| Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging | |
| Liu, Yang; Meerwijk, Joost; Luo, Liangliang; Zhang, Honglin; Sun, Fenglian; Yuan, Cadmus A.; Zhang, Guoqi | |
| 2014 | |
| Source Publication | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
 |
| Volume | 25Issue:11Pages:4954-4959 |
| Subject Area | 半导体器件 |
| Indexed By | SCI |
| Language | 英语 |
| Date Available | 2015-03-20 |
| Document Type | 期刊论文 |
| Identifier | http://ir.semi.ac.cn/handle/172111/26099 |
| Collection | 中科院半导体照明研发中心 |
| Recommended Citation GB/T 7714 | Liu, Yang,Meerwijk, Joost,Luo, Liangliang,et al. Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2014,25(11):4954-4959. |
| APA | Liu, Yang.,Meerwijk, Joost.,Luo, Liangliang.,Zhang, Honglin.,Sun, Fenglian.,...&Zhang, Guoqi.(2014).Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,25(11),4954-4959. |
| MLA | Liu, Yang,et al."Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 25.11(2014):4954-4959. |
| Files in This Item: | ||||||
| File Name/Size | DocType | Version | Access | License | ||
| Formation and evolut（3085KB） | 限制开放 | License | Application Full Text | |||
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