Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging | |
Liu, Yang; Meerwijk, Joost; Luo, Liangliang; Zhang, Honglin; Sun, Fenglian; Yuan, Cadmus A.; Zhang, Guoqi | |
2014 | |
Source Publication | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
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Volume | 25Issue:11Pages:4954-4959 |
Subject Area | 半导体器件 |
Indexed By | SCI |
Language | 英语 |
Date Available | 2015-03-20 |
Document Type | 期刊论文 |
Identifier | http://ir.semi.ac.cn/handle/172111/26099 |
Collection | 中科院半导体照明研发中心 |
Recommended Citation GB/T 7714 | Liu, Yang,Meerwijk, Joost,Luo, Liangliang,et al. Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2014,25(11):4954-4959. |
APA | Liu, Yang.,Meerwijk, Joost.,Luo, Liangliang.,Zhang, Honglin.,Sun, Fenglian.,...&Zhang, Guoqi.(2014).Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,25(11),4954-4959. |
MLA | Liu, Yang,et al."Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 25.11(2014):4954-4959. |
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Formation and evolut(3085KB) | 限制开放 | License | Application Full Text |
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