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Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging
Liu, Yang; Meerwijk, Joost; Luo, Liangliang; Zhang, Honglin; Sun, Fenglian; Yuan, Cadmus A.; Zhang, Guoqi
2014
Source PublicationJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume25Issue:11Pages:4954-4959
Subject Area半导体器件
Indexed BySCI
Language英语
Date Available2015-03-20
Document Type期刊论文
Identifierhttp://ir.semi.ac.cn/handle/172111/26099
Collection中科院半导体照明研发中心
Recommended Citation
GB/T 7714
Liu, Yang,Meerwijk, Joost,Luo, Liangliang,et al. Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2014,25(11):4954-4959.
APA Liu, Yang.,Meerwijk, Joost.,Luo, Liangliang.,Zhang, Honglin.,Sun, Fenglian.,...&Zhang, Guoqi.(2014).Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,25(11),4954-4959.
MLA Liu, Yang,et al."Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 25.11(2014):4954-4959.
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