SEMI OpenIR  > 中科院半导体照明研发中心
Chip-on-Flexible Packaging for High-Power Flip-Chip Light-Emitting Diode by AuSn and SAC Soldering
Liu, Yang; Zhao, Jia; Yuan, Cadmus Chang-Ann; Zhang, Guoqi Q; Sun, Fenglian
2014
Source PublicationIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
Volume4Issue:11Pages:1754-1759
Subject Area半导体器件
Indexed BySCI
Language英语
Date Available2015-03-20
Document Type期刊论文
Identifierhttp://ir.semi.ac.cn/handle/172111/26098
Collection中科院半导体照明研发中心
Recommended Citation
GB/T 7714
Liu, Yang,Zhao, Jia,Yuan, Cadmus Chang-Ann,et al. Chip-on-Flexible Packaging for High-Power Flip-Chip Light-Emitting Diode by AuSn and SAC Soldering[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2014,4(11):1754-1759.
APA Liu, Yang,Zhao, Jia,Yuan, Cadmus Chang-Ann,Zhang, Guoqi Q,&Sun, Fenglian.(2014).Chip-on-Flexible Packaging for High-Power Flip-Chip Light-Emitting Diode by AuSn and SAC Soldering.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,4(11),1754-1759.
MLA Liu, Yang,et al."Chip-on-Flexible Packaging for High-Power Flip-Chip Light-Emitting Diode by AuSn and SAC Soldering".IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 4.11(2014):1754-1759.
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