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A wafer-level Sn-rich Au–Sn intermediate bonding technique with high strength
Zhiqiang Fang, Xu Mao, Jinling Yang and Fuhua Yang
2013
Source PublicationJournal of Micromechanics and Microengineering
Volume23Issue:9
Subject Area半导体器件
Indexed BySCI
Language英语
Date Available2014-03-26
Document Type期刊论文
Identifierhttp://ir.semi.ac.cn/handle/172111/24560
Collection半导体集成技术工程研究中心
Recommended Citation
GB/T 7714
Zhiqiang Fang, Xu Mao, Jinling Yang and Fuhua Yang. A wafer-level Sn-rich Au–Sn intermediate bonding technique with high strength[J]. Journal of Micromechanics and Microengineering,2013,23(9).
APA Zhiqiang Fang, Xu Mao, Jinling Yang and Fuhua Yang.(2013).A wafer-level Sn-rich Au–Sn intermediate bonding technique with high strength.Journal of Micromechanics and Microengineering,23(9).
MLA Zhiqiang Fang, Xu Mao, Jinling Yang and Fuhua Yang."A wafer-level Sn-rich Au–Sn intermediate bonding technique with high strength".Journal of Micromechanics and Microengineering 23.9(2013).
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