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Shock-induced brittle cracking in HVPE-GaN processed by laser lift-off techniques
Su, X. J.; Xu, K.; Xu, Y.; Ren, G. Q.; Zhang, J. C.; Wang, J. F.; Yang, H.
2013
Source PublicationJOURNAL OF PHYSICS D-APPLIED PHYSICS
Volume46Issue:20Pages:205103
Subject Area光电子学
Indexed BySCI
Language英语
Date Available2013-08-27
Document Type期刊论文
Identifierhttp://ir.semi.ac.cn/handle/172111/24272
Collection集成光电子学国家重点实验室
Recommended Citation
GB/T 7714
Su, X. J.,Xu, K.,Xu, Y.,et al. Shock-induced brittle cracking in HVPE-GaN processed by laser lift-off techniques[J]. JOURNAL OF PHYSICS D-APPLIED PHYSICS,2013,46(20):205103.
APA Su, X. J..,Xu, K..,Xu, Y..,Ren, G. Q..,Zhang, J. C..,...&Yang, H..(2013).Shock-induced brittle cracking in HVPE-GaN processed by laser lift-off techniques.JOURNAL OF PHYSICS D-APPLIED PHYSICS,46(20),205103.
MLA Su, X. J.,et al."Shock-induced brittle cracking in HVPE-GaN processed by laser lift-off techniques".JOURNAL OF PHYSICS D-APPLIED PHYSICS 46.20(2013):205103.
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