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In-situ SEM investigation of sub-microscale deformation fields around a crack-tip in silicon
Li, J.J; Zhao, C.W; Xing, Y.M; Hou, X.H; Fan, Z.C; Jin, Y.J; Wang, Y
2012
Source PublicationOptics and Lasers in Engineering
Volume50Issue:12Pages:1694-1698
Subject Area微电子学
Indexed ByEI
Language英语
Date Available2013-05-07
Document Type期刊论文
Identifierhttp://ir.semi.ac.cn/handle/172111/24008
Collection半导体集成技术工程研究中心
Recommended Citation
GB/T 7714
Li, J.J,Zhao, C.W,Xing, Y.M,et al. In-situ SEM investigation of sub-microscale deformation fields around a crack-tip in silicon[J]. Optics and Lasers in Engineering,2012,50(12):1694-1698.
APA Li, J.J.,Zhao, C.W.,Xing, Y.M.,Hou, X.H.,Fan, Z.C.,...&Wang, Y.(2012).In-situ SEM investigation of sub-microscale deformation fields around a crack-tip in silicon.Optics and Lasers in Engineering,50(12),1694-1698.
MLA Li, J.J,et al."In-situ SEM investigation of sub-microscale deformation fields around a crack-tip in silicon".Optics and Lasers in Engineering 50.12(2012):1694-1698.
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