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Analysis of the ohmic contacts of Ti/Al/Ni/Au to AlGaN/GaN HEMTs by the multi-step annealing process
Yan, Wei; Zhang, Renping; Du, Yandong; Han, Weihua; Yang, Fuhua
2012
Source PublicationJournal of Semiconductors
Volume33Issue:6Pages:064005
Subject Area人工智能
Indexed ByEI
Language英语
Date Available2013-04-22
Document Type期刊论文
Identifierhttp://ir.semi.ac.cn/handle/172111/23932
Collection半导体集成技术工程研究中心
Recommended Citation
GB/T 7714
Yan, Wei,Zhang, Renping,Du, Yandong,et al. Analysis of the ohmic contacts of Ti/Al/Ni/Au to AlGaN/GaN HEMTs by the multi-step annealing process[J]. Journal of Semiconductors,2012,33(6):064005.
APA Yan, Wei,Zhang, Renping,Du, Yandong,Han, Weihua,&Yang, Fuhua.(2012).Analysis of the ohmic contacts of Ti/Al/Ni/Au to AlGaN/GaN HEMTs by the multi-step annealing process.Journal of Semiconductors,33(6),064005.
MLA Yan, Wei,et al."Analysis of the ohmic contacts of Ti/Al/Ni/Au to AlGaN/GaN HEMTs by the multi-step annealing process".Journal of Semiconductors 33.6(2012):064005.
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