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"半导体集成化芯片系统基础研究"重大研究计划结束综述
陈弘毅; 陈宇; 孙玲; 郭睿倩; 潘庆; 何杰
2011
Source Publication中国科学基金
Volume25Issue:2Pages:77-84
Abstract本文介绍了"半导体集成化芯片系统基础研究"重大研究计划立项背景、宗旨、总体科学目标、实施过程的基本情况以及取得的主要创新成果, 并分析了目前我国在该领域仍然存在的差距和问题
metadata_83中科院半导体照明研发中心
Subject Area半导体材料
Funding Organization基金
Indexed ByCSCD
Language中文
CSCD IDCSCD:4160391
Date Available2012-07-17
Citation statistics
Document Type期刊论文
Identifierhttp://ir.semi.ac.cn/handle/172111/23303
Collection中科院半导体照明研发中心
Recommended Citation
GB/T 7714
陈弘毅,陈宇,孙玲,等. "半导体集成化芯片系统基础研究"重大研究计划结束综述[J]. 中国科学基金,2011,25(2):77-84.
APA 陈弘毅,陈宇,孙玲,郭睿倩,潘庆,&何杰.(2011)."半导体集成化芯片系统基础研究"重大研究计划结束综述.中国科学基金,25(2),77-84.
MLA 陈弘毅,et al.""半导体集成化芯片系统基础研究"重大研究计划结束综述".中国科学基金 25.2(2011):77-84.
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