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The fabrication and characteristic analysis of polyimide-based neural microelectrodes
Li, Xiaoqian; Pei, Weihua; Gui, Qiang; Guo, Kai; Wang, Yu; Wang, Kai; Tang, Rongyu; Chen, Hongda; Pei, W.(peiwh@semi.ac.cn)
2011
Source PublicationGaojishu Tongxin/Chinese High Technology Letters
ISSN10020470
Volume21Issue:12Pages:1323-1328
AbstractA method of fabricating flexible neural microelectrodes based on non-photosensitive polyimide PI-5J was proposed, and a novel flexible neural stimulating microelectrode array was designed and fabricated by the traditional photolithography process for animal implantation. The degeneration and electrical characteristics of this fabricated microelectrode array were tested in vitro. Its biocompatibility was tested in vivo. The results show the array's good degeneration-resistance, good biocompatibility and good electrical characteristics, which are the bases for its next stage tests in vivo. The fabrication method of the flexible microelectrode array proposed in the paper will promote the basic research on neural science, and the treatment, the rehabilitation of neural diseases.
metadata_83集成光电子学国家重点实验室
KeywordBiocompatibility Diseases Fabrication Light Sensitive Materials Photolithography Photosensitivity Polyimides
Subject Area光电子学
Indexed ByEI
Language中文
Date Available2012-06-13
Document Type期刊论文
Identifierhttp://ir.semi.ac.cn/handle/172111/22969
Collection集成光电子学国家重点实验室
Corresponding AuthorPei, W.(peiwh@semi.ac.cn)
Recommended Citation
GB/T 7714
Li, Xiaoqian,Pei, Weihua,Gui, Qiang,et al. The fabrication and characteristic analysis of polyimide-based neural microelectrodes[J]. Gaojishu Tongxin/Chinese High Technology Letters,2011,21(12):1323-1328.
APA Li, Xiaoqian.,Pei, Weihua.,Gui, Qiang.,Guo, Kai.,Wang, Yu.,...&Pei, W..(2011).The fabrication and characteristic analysis of polyimide-based neural microelectrodes.Gaojishu Tongxin/Chinese High Technology Letters,21(12),1323-1328.
MLA Li, Xiaoqian,et al."The fabrication and characteristic analysis of polyimide-based neural microelectrodes".Gaojishu Tongxin/Chinese High Technology Letters 21.12(2011):1323-1328.
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