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Molecular dynamics simulation for heat transport in thin diamond nanowires | |
Jiang JW; Wang BS; Wang JS; Jiang, JW (reprint author), Natl Univ Singapore, Dept Phys, Singapore 117542, Singaporephyjj@nus.edu.sg | |
2011 | |
Source Publication | PHYSICAL REVIEW B
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ISSN | 1098-0121 |
Volume | 83Issue:23Pages:235432 |
Abstract | It is found that the thermal conductivity in narrower DNW is lower and does not show obvious temperature dependence; a very small value (about 2.0 W/m/K) of thermal conductivity is observed in ultra-narrow DNW, which may be of potential applications in thermoelectric devices. These two phenomena are probably due to the dominant surface effect and phonon confinement effect in narrow DNW. Our simulation reveals a high anisotropy in the heat transport of DNW. Specifically, the thermal conductivity in DNW along [110] growth direction is about five times larger than that of [100] and [111] growth directions. The anisotropy is believed to root in the anisotropic group velocity for acoustic phonon modes in DNW along three different growth directions. |
metadata_83 | 半导体超晶格国家重点实验室 |
Keyword | Lattice Thermal-conductivity Silicon Nanowires Confinement Nanotubes |
Subject Area | 半导体物理 |
Funding Organization | National University of Singapore[R-144-000-257-112] |
Indexed By | SCI |
Language | 英语 |
Date Available | 2012-01-06 |
Document Type | 期刊论文 |
Identifier | http://ir.semi.ac.cn/handle/172111/22697 |
Collection | 半导体超晶格国家重点实验室 |
Corresponding Author | Jiang, JW (reprint author), Natl Univ Singapore, Dept Phys, Singapore 117542, Singaporephyjj@nus.edu.sg |
Recommended Citation GB/T 7714 | Jiang JW,Wang BS,Wang JS,et al. Molecular dynamics simulation for heat transport in thin diamond nanowires[J]. PHYSICAL REVIEW B,2011,83(23):235432. |
APA | Jiang JW,Wang BS,Wang JS,&Jiang, JW .(2011).Molecular dynamics simulation for heat transport in thin diamond nanowires.PHYSICAL REVIEW B,83(23),235432. |
MLA | Jiang JW,et al."Molecular dynamics simulation for heat transport in thin diamond nanowires".PHYSICAL REVIEW B 83.23(2011):235432. |
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